Our PCB Manufacturing Capabilities

PCB CAPABILITIES
Serial numberProjectProcessing capacity
1
Layers
1-12 Layers
2
Material

FR-4, Aulminum

3
Surface finish

HASL – Hot Air Solder Leveling,
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS

4
Thickness

FR4,0.40-2.4mm(0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4)

5
Thickness Tolerance

T≥1.0mm±10%;T<1.0mm±0.10mm

6

Max. Dimension

450x1200mm
7

Dimension Tolerance

±0.20mm
8
Min. Trace
3mil
9
Min. Spacing
3mil
10
Annular Ring
≥6mil
11
Trace/Spacing Tolerance
±20%mm
12
Finished Outlayer Copper
35-75um
13
Finished Inerlayer Copper
17-70um
14
Hole copper Thickness
≥23um
15

Drill Size

0.25-6.30mm

16

Min. slot

Metal Slot 0.65mm,Non-Metal Slot 0.80mm
17
Hole Size Tolerance
NPTH:<0.8mm:±0.05mm;0.81-1.80mm:±0.08mm;1.8-5.0mm:±0.10mm

PTH:<0.8mm:±0.08mm;0.81-1.80mm:±0.10mm;1.8-5.0mm:±0.127mm

VIA:+0.08mm,

18
Solder Mask
LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)
19
Solder mask thickness
10-15UM
20
Silkscreen Color
White, Blue, Black Yellow
21
Min. Character Width
≥0.15mm
22
Min. Character Height
≥0.80mm
23
Min. Half Hole Diameter
≥0.50mm